Grand Process Technology Company (GPTC), a Taiwan-based semiconductor equipment company involved in the supply chain for TSMC ...

The packaging technology is said to be strongly based on TSMC's chip-on-wafer-on-substrate with silicon interposer (CoWoS-S) and clearly distinguishable from Samsung's and Intel's packaging ...

we all know it... but now rumors are swirling that Intel Foundry and Samsung Foundry could combine forces to compete against the semiconductor leader: TSMC. In a new video from leaker Moore's Law ...

Sophgo had ordered chips from TSMC that matched the one found on Huawei's Ascend 910B, the people said. Huawei is restricted from buying the technology to protect U.S. national security.

“TSMC is now truly a turf all major powers want to secure,” Chang said at a company event in Hsinchu on Saturday, amplifying a concept he first raised in 2019. “Free trade of ...

Taiwan Semiconductor Manufacturing Company (TSMC) has achieved early production yields at its first plant in Arizona that surpass similar factories back home, a significant breakthrough for a US ...

“We could really change the map of urban development in medieval Asia,” he says in the statement. “The Silk Road wasn’t just about the endpoints of China and the West,” he adds.

TAIPEI – Taiwan Semiconductor Manufacturing Company (TSMC) discovered in October that chips it made for a specific customer ended up with Huawei Technologies, a potential violation of US ...

Taiwan Semiconductor Manufacturing Co. discovered this month that chips it made for a specific customer ended up with Huawei Technologies Co., a potential violation of U.S. sanctions intended to ...

About two weeks ago, TSMC suspended shipments to the client and began a detailed investigation, the trade and economic official said, speaking on condition of anonymity given the sensitivity of ...

Nvidia’s Blackwell B100 and B200 GPUs link their two chiplets using TSMC's CoWoS-L packaging technology, per Tom’s Hardware. A mismatch between chip components could cause the components to fail.

These chips employ TSMC's CoWoS-L packaging, which utilizes an RDL interposer with local silicon interconnect bridges to achieve data transfer rates of about 10 TB/s. The problem arose from a ...