UMass Lowell8mon
EECE.5040 VLSI Fabrication (Formerly 16.504)
Fabrication of resistors, capacitors, p-n junction and Schottky Barrier diodes, BJT's and MOS devices and Integrated circuits. Topics include: silicon structure, wafer preparation, sequential ...
UMass Lowell3y
EECE.4040 VLSI Fabrication (Formerly 16.470/EECE.4700)
Fabrication of resistors, capacitors, p-n junction and Schottky barrier diodes, BJT's and MOS devices and integrated circuits. Topics include: silicon structure, wafer preparation, sequential ...
Design-Reuse4y
VLSI Physical Design Methodology for ASIC Development with a Flavor of IP Hardening
We must get success on first cut as the Designing, Verification and Fabrication of chip is costly and time to ... then it is better to get ready IP by some IP provider to make the process faster. Here ...
Engineering360 News6y
Digital Integrated Circuit Design from VLSI Architectures to CMOS Fabrication
Reflects industry design methods, moving from VLSI architecture design to CMOS fabrication. Practical hints and tips ... reflecting the nature of the design process in industry. Starting with ...
Michigan Technological University3y
Electronics Materials and Processing—Graduate Certificate
Design VLSI circuits using CAD tools ... and the other technologies that are central to MEMS fabrication. Fundamentals of micromachining and microfabrication techniques, including planar thin-film ...