TL;DR: TSMC is considering building new CoWoS advanced packaging plants in the US and Japan due to strong demand, particularly for AI chips from NVIDIA. The company plans to double its production ...
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Amkor and TSMC team up for advanced packaging in the U.S. — CoWoS and InFo to make AI and HPC CPUsWhen Amkor announced plans to build a $1.6 billion chip test and packaging facility near Peoria, Arizona, it was clear that ...
Originally, the industry rumor mill expected TSMC's CoWoS capacity expansion to start leveling off by 2026. Early projections had the company's monthly packaging volume topping out around 100,000 ...
TSMC's CoWoS capacity expansion is currently focused on AP6, an advanced packaging plant in Zhunan, and it plans to add the AP5 plant in Taichung to its production capacity in 4Q24, the company said.
The platform supports both the TSMC CoWoS-S (silicon Interposer) and the CoWoS-R (organic interposer) advanced packaging technologies. The platform represents real-world CPU/GPU/AI/Networking chips by ...
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